We are obsessed with quality, and we always aim for a flawless design and functionality of our High-Frequency PCB  products. We have laid out a 5-step quality inspection procedure to ensure our products are 100% functional:
First Article Inspection (FAI)
Sun &Lynn  acknowledges FAI as the initial step of quality inspection before the mass production of circuit boards. We put up this step to avoid producing large quantities of defective products due to processing and operational issues.
We inspect every resistor, capacitance, and inductance using an LCR meter. Besides, we use QC with BOM and Assembly drawing to verify chips.
Automatic Optical Inspection (AOI)
The AOI process verifies the placement of electronic components and solder joints after SMT. The primary objective is to get the highest quality control and detect and remove defects in the earlier stages of the assembling process.
X-Ray Inspection
In this step, we use short wavelengths of 0.0006-80nm to penetrate various High-Frequency PCB materials. Designs with BGA and QFN packages have solder joints that are not easily visible by human eyes. We employ X-ray machines to inspect such packages in the final printed circuit board assembly.
Final Quality Assurance (FQA)
After carrying out FAI, AOI, and X-Ray inspections, our quality engineers conduct the last visual quality inspection process for all products. This process ensures that products have gone through all the assembling processes and are of good quality.
Function Test
Finally, we also conduct functional tests on all automated test equipment to simulate different loads, typically average, peak, and abnormal loads. This is a complicated process that involves various tool-based and programming tests. Additionally, this step requires customer technical support.