PCBmanufacturerChina talked：the Process of Manufacturing PCB Blind-via（盲孔）

1. Sequential lamination

In this process, an extremely thin laminate undergoes all the production steps required to manufacture a double-sided PCB. It is drilling, etching, and plating. Subsequently, this layer is stacked with all other layers of the PCB. The number of manufacturing steps involved in this method of manufacturing blind vias makes it very expensive.

2. Photo defined

PCBsupplier learned that，this manufacturing process involves laminating photosensitive resin sheets onto the core. The pattern covering the photosensitive film is exposed to light, making the remaining material hard. Remove the material from the hole using an etching solution. Copper is plated on the holes and outer surface to create the outer layer of the PCB. When there are a large number of blind vias on the PCB, this blind via production method is cost-effective.

3. Controlled depth

This method uses the same drilling process as through-hole drilling. In addition to drilling a certain depth hole on the PCB and then plating it on. Generally speaking, drilling is a cost driver, but this method is the cheapest way to manufacture blind via, but the minimum width that can be drilled depends on the smallest available drill bit size, typically 0.15 mm.

4. Laser drilled

This process is completed after all layers of the PCB are laminated, but before the outer layer is etched and laminated. By laser drilling copper and dielectric materials in one stage, a through hole can be created. This is an economically effective method. To reduce costs and shorten production time, laser drilling holes may be a better choice than through holes.

FPCmanufacturer learned that，PCB blind via circuit boards plays a crucial role in the performance and stability of electronic products. They can reduce signal interference, increase board density and number of holes, and improve the stability of electronic products.