| Technology capability | ||||
| P C B | ||||
| Item | Standard | Advanced | ||
| Layer count | 40L | 48L | ||
| Board thickness | 5.5mm | 6.5mm | ||
| Aspect ratio | 10:1 | 14:1 | ||
| Copper thickness | 6OZ | 12OZ | ||
| Maxium PCB size | 1L: | 500×2000mm | 540×2000mm | |
| 2L : | 500×1200mm | 540×1200mm | ||
| ≥4L: | 540*650mm | 540*650mm | ||
| Min. 4L board thickness | 0.38mm | 0.35mm | ||
| Min. hole & pad size | 0.20/0.40mm | 0.15/0.35mm | ||
| Drilling Acuracy | ±0.05mm | ±0.038mm | ||
| Min. solder mask bridge | 0.065mm | 0.065mm | ||
| PTH hole size tolerance | ±0.05mm | ±0.038mm | ||
| Contour tolerance | ±0.05mm | ±0.05mm | ||
| Impedance tolerance | ±8% | ±6%(Differential impedance) | ||
| Min. line width/spacing | 0.075/0.075mm | 0.065/0.065mm | ||
| Surface finish | ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink | |||
| H D I | ||||
| Item | Standard | Advanced | ||
| HDI stage | 3+N+3 | Anylayer | ||
| Aspect ratio for blind via | 1:1 | 1:1 | ||
| Min. 8L board thickness | 0.70mm | 0.65mm | ||
| Min. line width/spacing | 0.05/0.05mm | 0.05/0.05mm | ||
| Key line/tolerance | 0.065mm/15% | 0.06mm/10% | ||
| Min. blind via diameter | 0.10mm | 0.09mm | ||
| Min. capture pad size | 0.23mm | 0.20mm | ||
| Min. PTH diameter | 0.20mm | 0.175mm | ||
| Min. PTH PAD size | 0.35mm | 0.30mm | ||
| Min. clearance(copper to SM opening) | 0.038mm | 0.025mm | ||
| Min. solder mask bridge | 0.065mm | 0.065mm | ||
| Min. CSP/BGA pitch | 0.40mm | 0.35mm | ||
| PTH hole size tolerance | ±0.05mm | ±0.038mm | ||
| Contour tolerance | ±0.05mm | ±0.05mm | ||
| Impedance tolerance | ±8% | ±6%(for differential impedance) | ||
| Surface finish | ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink | |||
| F P C | ||||
| Item | Standard | Advanced | ||
| Layer count | 8L | 10L | ||
| Maxium PCB size | 2000*240mm | 2000*240mm | ||
| Min. line width/spacing | 1/4OZ | 0.04mm | 0.04mm | |
| 1/3OZ | 0.05mm | 0.05mm | ||
| 1/2OZ | 0.055mm | 0.055mm | ||
| Min. PTH size | 0.15mm | 0.1mm | ||
| Min. PTH PAD size | 0.25mm | 0.2mm | ||
| Min. blind via diameter | 0.10mm | 0.075mm | ||
| Min. capture pad size | 0.25mm | 0.175mm | ||
| Min. solder mask bridge | 0.065mm | 0.065mm | ||
| Coverlay registration tolerance | 0.15mm | 0.10mm | ||
| PTH hole size tolerance | ±0.05mm | ±0.038mm | ||
| Contour tolerance | ±0.05mm | ±0.05mm | ||
| Impedance tolerance | ±8% | ±6%(for differential impedance) | ||
| Min. slot hole width | 0.60mm | 0.50mm | ||
| Pitch tolerance | ±0.05mm | ±0.03mm | ||
| Air Gap capability | YES | Yes | ||
| Surface finish | ENIG, OSP, Gold plating(hard gold) | |||
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