Structure of Multilayer PCB Boards
Structure of Multilayer PCB Boards：
Dielectric: Used to maintain the insulation between the circuit and each layer, commonly known as the substrate.
Through-hole / via Vias can connect the lines of more than two layers, larger vias are used to insert components, and non-plating through-hole (NPTH) is used for surface mount positioning and fixing screws during assembly.
Solder resistant /Solder Mask: According to different processes, it is divided into green oil, red oil, and blue oil.
Legend /Marking/Silkscreen: This is a non-essential structure. The primary function is to mark each part’s name and position frame on the circuit board to facilitate maintenance and identification after assembly.
Surface Finish: Since the copper surface is easily oxidized in the general environment, resulting in poor solderability, it is necessary to protect the copper surface. The protection methods are HASL, ENIG, Immersion Gold, Immersion Silver, Immersion Tin, and OSP. Each has its advantages and disadvantages, collectively referred to as surface treatment.
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