PCB factory china The Characteristics of Heat Flux Used in Hot Air Leveling
As PCB factory china knows that, the HASL process involves the use of special heat flux. Also, this flux plays a crucial role in activating the exposed copper surface of the board. However, heat flux must have the following characteristics to perform well:
Non-toxic and water-soluble
Water-soluble flux has less board residue and is easy to clean. Also, this flux won’t form any ion pollution in the printed circuit board. This flux can meet environmental standards without any special treatment.
Thermal stability
With good thermal stability, the PCB won’t have green oil.
Good activity
Copper surface layer removal facilitates solder wettability on the copper surfaces. Also, it is important to consider the good activity and the minimum corrosion of copper. Also, you need to minimize the solubility of copper in the solder.
Certain viscosity
The flux needs a certain level of viscosity. Also, the flux needs certain viscosity in order to protect the laminate surface.
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