Lead-free hot air leveling for rigid flex PCB
Lead-free hot air leveling for rigid flex PCB：
Application: Replace SnPb HASL.
Cost: medium to high.
Compatibility with lead-free: compatible.
Storage period: 12 months.
Solderability (wettability): high.
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Disadvantages:
* Not suitable for devices with pin center distance <0.5mm, because bridging is prone to occur.
* Not suitable for places with high coplanarity requirements, such as BGAs with medium and high pin counts because of HASL* * Process plating thickness changes relatively large, and the coplanarity between pads and pads is poor.
* Due to the relatively large thickness of the plating layer, the hole diameter (DHS) must be compensated to obtain the desired finished metalized hole diameter (FHS), typically FHS=DHS-4~6mil.
* Due to the high peak temperature of the surface treatment, thermally stable dielectric materials must be used.
Supplier resources: Currently limited, but with the development of using lead-free processes, it will be more and more.
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