HDI technology is increasingly becoming the solution for smaller, more durable, and more efficient Multi-layer PCBs. HDI technology allows for lighter, smaller products that do more faster than ever before by leveraging blind and buried vias that can be staggered, stacked, and integrated with microvias.

This type of PCB technology allows for improved functionality in smaller consumer products, denser BGA and QFP packages, and lowered heat transfer induced stress.

HDI FEATURES AND BENEFITS

Allows designers to incorporate more components onto smaller boards because HDI Multi-layer PCBs can be populated on both sides of the board.

Decrease power usage, leading to longer battery life in handheld and other battery powered devices.

More solid and rugged, allowing for increased strength and limited perforations

Reduced thermal degradation, elongating the life of the device.

Allow for more efficient and higher density transmission and computation in smaller areas and the creation of smaller end-user products such as smartphones, aerospace equipment, military devices, and medical equipment.

Sustainability of Dense BGA and QFP Packages in PCB Design

If you are using smaller BGA and QFP packages in your designs and applications, HDI PCBs offer more reliability in transmission when your Multi-layer PCB design gets to the point of mass production. HDI PCBs can accommodate more dense BGA and QFP packages than older PCB technology.

Reduced Heat Transfer

Heat transfer is reduced because there is less distance for heat to travel before it can escape an HDI PCB. HDI PCBs also undergo less stress due to thermal expansion, extending the life of the PCB.

Managed Conductivity

Vias can then be filled with conductive or non-conductive materials to facilitate transmission between components depending on your board design.

Functionality is also improved as blind vias and via-in-pad allow components to be placed closer together. When the transmission range from component to component is reduced, transmission times and crossing delays are decreased, while signal strength is increased.

Smaller (and Smaller) Form Factors

When it comes to saving space, HDIs are a fantastic option as the total number of layers can be reduced. For example, a traditional 8-layer through-hole PCB can easily be replaced by a 4-layer HDI via-in-pad solution. This results in smaller PCBs that contain vias that are more or less invisible to the naked eye.

Ultimately, using HDI PCBs allow for the creation of smaller, more durable, and more efficient products that consumers want without compromising design and overall performance.