Key points of high frequency PCB design
High frequency PCB often have high integration and high wiring density. The use of multilayer circuit board is not only necessary for wiring, but also an effective way to reduce interference. In the PCB layout stage, a reasonable selection of a certain number of printed circuit board size can make full use of the middle layer to set the shielding, to achieve better near-grounding, effectively reduce parasitic inductance, shorten transmission length by reducing the crosstalk signal, etc., all of these methods are conducive to the reliability of high-frequency PCB.
According to the data, the noise of the four-layer board is 20dB lower than that of the double-layer board. But there are problems. The higher the number of PCB half layers, the more complex the manufacturing process and the higher the unit cost. This requires us to select an appropriate number of PCB boards for PCB layout. Correct component layout planning and correct wiring rules to complete the design.
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