Immersion Silver (ImAg) Multi-layer PCB Surface Finish
Immersion silver (ImAg) is a metallic coating of pure silver (0.1 to 0.4 μm), which acts as a preservative for the copper traces on a printed circuit board. It is a combination of 99% Ag metal with traces of organic material. With time, ImAg forms Sulfide Dendrites that cause a shorting problem. This problem can be avoided by applying a thin organic coat, which acts as a barrier.
An Immersion silver (ImAg) finish on a Multi-layer PCB is suitable for the applications that include flat surfaces like membrane switches, EMI shielding, aluminum wire bonding, and very fine traces.
Properties of Immersion Silver Surface Finish:
Shelf-life: 6 to 12 months
Offers good solderability
Due to its planarity (flatness), suitable for fine-pitch/BGA/Small components placement
Offers good solderability after exposure to various thermal cycles (more than 2)
Suitable for high-frequency applications
Limiting Properties of Immersion Silver Surface Finish:
Sensitive to handle and sensative to contaminants
Has a solder whiskering issue
Difficult for electric testing
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