What is PCB Delamination in FPC manufacturer's factory?
The partial separation of the layers of a Printed Circuit Board FPC that FPC manufacturer is called PCB Delamination.
Delamination can also be defined as the separation of either the resin from the laminate or the fiberglass from the resin. It leads to gaps or bubbles in the PCB that looks like blisters. This process usually occurs in multilayer PCBs.
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What Causes PCB Delamination?
Delamination is usually caused by unwanted heat or humidity present during the manufacturing process. Humidity build-up in the laminate is the main cause for the creation of gaps between layers. The humidity is often caused by the heating elements used in the PCB Fabrication/Assembly process in FPC manufacturer’s factory.
Delamination can also be caused by excessive thermal stress during the soldering or rework process. Other causes include a poorly controlled lamination process or using the wrong glass transition temperature.
PCB Delamination can also occur while storing or using the PCB in environments of extreme heat or humidity.
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