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What are the Stages Involved In Performing High Volume Rigid flex PCB Production

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Popularity:501Dated :08-12-2022 03:18【big well Small

Below are the steps involved in Rigid flex PCB production of high volume

Preparation stage

You have to prepare the necessary materials required for the Rigid flex PCB assembly process.  What is required include solder masking components, materials, Rigid flex PCB  stackup, and production machines.

Furthermore, machines needed here include reflow ovens, placement machines, and stencil printers. With all these available, you will refer to the design and also check if everything needed is in place. Also, check the bill of materials and ensure all the needed products are in place.

One the materials are in place, you’ll arrange them and then start your machines.

Solder Paste Printing

The Rigid flex PCB assembly process for high volume production will begin with solder paste printing on the stackup. Make use of stencils and squeegees during the process of solder printing. Jet solder paste printing is also an alternative.

Placement of the component

This stage involves the movement of the Rigid flex PCB stackup with the solder paste to the next available machine. This helps in picking and placing the Rigid flex PCB components.

This process also moves at an extremely high speed since a computer usually controls everything that has to do with the design.

Once complete, you will inspect the components. Here automatic optical inspection is used. This checks errors present on the Rigid flex PCB.

Reflow Soldering

Next, the Rigid flex PCB move to the machine for reflow soldering. Here, all the connections of the electric solder forms here. The heating of the Rigid flex PCB is the best possible mode of the reflow soldering. This should be done at the right temperatures, which connects the connections.

The process is then completed when you perform an automatic inspection so as to find or detect errors. Also, take note that the entire process takes place very quickly therefore producing printed circuit boards at very high volumes.

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