HealthcarePCB manufacturer talk，whether in the manufacturing assembly process or in actual use, it is critical that the PCB has reliable performance.   In addition to related costs, defects in the assembly process may be brought into the final product by the PCB, and failures may occur during actual use, resulting in claims.   Therefore, from this point of view, the cost of a high-quality PCB is negligible.   Although the initial cost of a reliable, guaranteed, and long-life product is high, it is worth the money in the long run.

HealthcarePCB

10 important features of high reliability PCBs:

1.   25 micron copper wall thickness
Benefits: Increased reliability, including improved z-axis expansion resistance.

Risks of not doing so: blow holes or degassing, electrical connectivity problems during assembly (inner layer separation, hole wall breakage), or failure under load conditions during actual use.

2.   No welding repair or open circuit repair
Benefits: perfect circuit ensures reliability and safety, no maintenance, no risk

Risk of not doing this: If not repaired properly, the circuit board will break.   Even if the repair is 'proper', there is a risk of failure under load conditions (vibration, etc.), which may cause failure in actual use.

3.   Cleanliness requirements beyond IPC specifications

Benefit: Improved PCB cleanliness improves reliability.

Risks of not doing so: residues on the circuit board and solder build-up pose risks to the solder mask.   Ionic residues can cause the risk of corrosion and contamination of the soldering surface, which can lead to reliability issues (bad solder joints / electrical failures).   Eventually increase the probability of actual failure.

4.   Strictly control the service life of each surface treatment
Benefits: solderability, reliability, and reduced risk of moisture intrusion

Risk of not doing this: soldering problems may occur due to metallographic changes on the surface of old circuit boards, and moisture intrusion may cause delamination, inner layers, and hole walls during assembly and / or actual use separation (open circuit) and other issues.

5.   Use internationally renowned substrates-do not use "local" or unknown brands
Benefit: Improved reliability and known performance

PCBmanufacturer talk,risks of not doing so: Poor mechanical properties mean that the board will not perform as expected under assembly conditions.  For example, higher swelling performance will cause delamination, disconnection, and warpage.   Impaired electrical characteristics can lead to poor impedance performance.

6.  The tolerance of copper clad board meets the requirements of IPC4101ClassB / L
Benefit: Strictly controlling the thickness of the dielectric layer can reduce the deviation in expected electrical performance.
Risk of not doing so: the electrical performance may not meet the required requirements, and the same batch of components will have large differences in output / performance.

7.   Define solder mask materials to ensure compliance with IPC-SM-840ClassT requirements
Benefits: Achieve ink safety and ensure solder mask inks meet UL standards.

Risks of not doing so: Poor inks can cause adhesion, flux resistance, and hardness issues.   All of these problems can cause the solder mask to separate from the circuit board and ultimately cause corrosion of the copper circuit.   Poor insulation properties can cause short circuits due to unexpected electrical connectivity / arc.

8.   Define tolerances for shape, hole and other mechanical features
Benefit: Strictly controlled tolerances can increase product dimensional quality-improve fit, form, and function

Risks of not doing so: problems during assembly, such as alignment / mating (press-fit needle problems will only be discovered when assembly is complete).   In addition, due to the increase in dimensional deviation, there are problems in mounting the base.

9.  Requirements on plug hole depth
Benefit: High quality plug holes will reduce the risk of failure during assembly.

Risks of not doing so: Chemical residues from the immersion gold process can remain in the holes where the plugs are dissatisfied, causing problems such as solderability.   In addition, tin beads may be hidden in the holes.   During assembly or actual use, the tin beads may splash out, causing a short circuit.

10.   Do not accept sleeves with scrap units
Benefit: Not using partial assembly can help customers improve efficiency.

FPCmanufacturer talk,Risk of not doing this: The defective cover plate requires a special assembly procedure.   If it is not clear whether the waste unit board (x-out) is marked or it is not isolated from the cover plate, it may be possible to assemble this already Known bad boards, wasting parts and time.