Technical Parameters
Part Number：M02C22186
Layer count：2
Board thickness：1.5mm
Dimension：293*203mm
Raw material：FR4+PI+NFPP
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.3mm
Minimum hole diameter：0.4mm
Surface finishing：ENIG
Application：Intelligent home
Technology Feature
?Rigid-flex board, laser profiling;
?Customized routing process to the rigid-flex connection;
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