Technical Parameters
Part Number：S10C31828
Layer count：10
Board thickness：1.2mm
Dimension：183*138mm
Raw material：FR4 EMC
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：22um
Min.line width/space：0.07mm
Minimum hole diameter：0.1mm
Surface finishing：ENIG Au≥1u"
Application：UAV
Technology Feature
?Min line width/space: 0.07mm;
?Min blind hole size: 0.1mm;
?Min BGA pad: 0.2mm and IPC class III complaint
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