Technical Parameters
Part Number：M04C20313
Layer count：4
Board thickness：0.8mm
Dimension：236*194mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.25mm
Minimum hole diameter：0.25mm
Surface finishing：ENIG Au≥1.2u"
Application：Wireless & RFID
Technology Feature
?Impedance control ±8%;
?Min.solder mask dam: 0.08mm;
?IPC class III compliant;
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