Technical Parameters
Part Number：S06C33470
Layer count：6
Board thickness：0.6mm
Dimension：119*79mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥2u"
Application：Photoelectric module
Technology Feature
?Twice laminations process;
?Mechanism blind via drilling, via size:0.2mm;
?Laser routing for blind slot, plated to full;
?Min. solder mask dam: 0.08mm;
*Your info requiredLeave
your contact info to ask for more product details
| * Contact name： | |
| Company name： | |
| * Phone number： | |
| Email： | |
| * Your message： | |
| Verification code： |
|
S&L product center
