Technical Parameters
Part Number：M18C09478
Layer count：18
Board thickness：4mm
Dimension：30*25mm
Raw material：FR4 SY
Copper thickness on the board surface：140um
Copper thickness in the hole barrel：70um
Min.line width/space：0.3mm
Minimum hole diameter：1.25mm
Surface finishing：ENIG Au≥2u"
Application：Heavy duty power supply
Technology Feature
?HLC board, ENIG
?Edge plated
?Barrel copper thickness>70um
?Resistance testing
?Copper thickness: 3oz(inner layer)/4oz(outter layer)
*Your info requiredLeave
your contact info to ask for more product details
| * Contact name： | |
| Company name： | |
| * Phone number： | |
| Email： | |
| * Your message： | |
| Verification code： |
|
S&L product center
Other
New energy & Power supply
