Technical Parameters
Part Number：M14C15781
Layer count：14
Board thickness：2.7mm
Dimension：148*90mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.2mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au：2-6u"
Application：Energy monitoring
Technology Feature
?Inner copper thickness: 5oz;
?L2-L3 buried via, L1-L2 blind via 0.2mm;
?Blind via resin plugging process;
?Durable for DC 2500V;
?Warp<0.7%, Ion chromatography test applied;
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