Part Number：L6C3485
Layer count：6
Board thickness：1.6mm
Dimension：267*229mm
Raw material：FR4 TUC
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.077mm
Minimum hole diameter：0.25mm
Surface finishing：ENIG Au：1-3u"
Application：Automatic production equipment

Part Number：M04R05861
Layer count：4
Board thickness：1.6mm
Dimension：211*182mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.2mm
Minimum hole diameter：0.4mm
Surface finishing：HASL
Application：Industrial computer

Part Number：M02S21361A
Layer count：2
Board thickness：0.9mm
Dimension：136*157mm
Raw material：FR4 ITEQ
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.3mm
Minimum hole diameter：0.5mm
Surface finishing：immersion Silver
Application：Filter

Part Number：M04U30102
Layer count：4
Board thickness：1.6mm
Dimension：260*188mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.3mm
Minimum hole diameter：0.5mm
Surface finishing：ENIG + Hard gold plating Au≥59.1u"
Application：Gear transmit

Part Number：M02C14789D0
Layer count：2
Board thickness：1.6mm
Dimension：246*187mm
Raw material：FR4 TUC
Copper thickness on the board surface：70um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.65mm
Surface finishing：ENIG Au≥2u"
Application：Automotive 
interior illumination

Part Number：M04E30968
Layer count：4
Board thickness：1.0mm
Dimension：166*162mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.1mm
Minimum hole diameter：0.45mm
Surface finishing：OSP
Application：Automotive audio system

Part Number：M06C34768
Layer count：6
Board thickness：1.6mm
Dimension：112*112mm
Raw material：FR4 SY
Copper thickness on the board surface：30-50um
Copper thickness in the hole barrel：20um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥1u"
Application：Driving recording

Part Number：M04C32254
Layer count：4
Board thickness：1.2mm
Dimension：109*85mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥1u"
Application：Driving recording

Part Number：M06C15681A
Layer count：6
Board thickness：0.8mm
Dimension：53*146mm
Raw material：FR4 ITEQ
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥1u"
Application：Driving recording

Part Number：M08C36456
Layer count：8
Board thickness：1.2mm
Dimension：240*117mm
Raw material：FR4 TUC
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：22um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥1u"
Application：Reverse imaging