Technical Parameters
Part Number:M04U30102
Layer count:4
Board thickness:1.6mm
Dimension:260*188mm
Raw material:FR4 SY
Copper thickness on the board surface:35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.3mm
Minimum hole diameter:0.5mm
Surface finishing:ENIG + Hard gold plating Au≥59.1u"
Application:Gear transmit
?None-lead hard gold plating, hard gold plating 59.1u” min;
?Combined surface finishings, Electroless gold + Immersion Gold + Hard gold plating;
?5 times dry film process, IPC class III compliant;
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