Technical Parameters
Part Number：M08C36456
Layer count：8
Board thickness：1.2mm
Dimension：240*117mm
Raw material：FR4 TUC
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：22um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥1u"
Application：Reverse imaging
Technology Feature
?Min.via size: 0.2mm;
?Solder mask plugging;
?Impedance control ±10%;
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