Technical Parameters
Part Number:M08C33097A
Layer count:8
Board thickness:1.0mm
Dimension:156*100mm
Raw material:FR4 TUC
Copper thickness on the board surface:35um
Copper thickness in the hole barrel:22um
Min.line width/space:0.09mm
Minimum hole diameter:0.2mm
Surface finishing:ENIG
Application:Intelligent home
Min via size: 0.2mm;
Impedance control: ±10%
Solder mask plugging
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