S& L

Leading the innovation of PCB technology with 87 patents With team of 400 engineers, we provide total PCB solution from design optimization consultant to cost-effective manufacturing

Technical Parameters

Part Number:S02B29437
Layer count:2
Board thickness:1.6mm
Raw material:FR4 ITEQ
Copper thickness on the board surface:35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.1mm
Minimum hole diameter:0.3mm
Surface finishing:Platinum plating + Gold plating
Application:Blood analyzer

Technology Feature

?3 times solder mask process (thickness: 20-25μm, registration: ±0.025mm);
?Hard gold plating+platinum plating, hard gold plating thickness: 47.24u";

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