Technical Parameters
Part Number：S02B29437
Layer count：2
Board thickness：1.6mm
Dimension：210*132mm
Raw material：FR4 ITEQ
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.1mm
Minimum hole diameter：0.3mm
Surface finishing：Platinum plating + Gold plating
Application：Blood analyzer
Technology Feature
?3 times solder mask process (thickness: 20-25μm, registration: ±0.025mm);
?Hard gold plating+platinum plating, hard gold plating thickness: 47.24u";
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