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Wi-Fi
Part Number：S08C35600
Layer count：8
Board thickness：0.8mm
Dimension：175*180mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENEPIG Au≥1.2u"
Application：Wi-Fi
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Photoelectric module
Part Number：S06C33470
Layer count：6
Board thickness：0.6mm
Dimension：119*79mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥2u"
Application：Photoelectric module
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Wireless & RFID
Part Number：M04C20313
Layer count：4
Board thickness：0.8mm
Dimension：236*194mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.25mm
Minimum hole diameter：0.25mm
Surface finishing：ENIG Au≥1.2u"
Application：Wireless & RFID