Part Number：S06C33470
Layer count：6
Board thickness：0.6mm
Dimension：119*79mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥2u"
Application：Photoelectric module 

▶Twice laminations process;
▶Mechanism blind via drilling, via size:0.2mm;
▶Laser routing for blind slot, plated to full;
▶Min. solder mask dam: 0.08mm;