Part Number：S08C35600
Layer count：8
Board thickness：0.8mm
Dimension：175*180mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENEPIG Au≥1.2u"
Application：Wi-Fi

▶Min.via size: 0.2mm;
▶Solder mask plugging
▶Impedance control ±8%;