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Part Number：M18C09478
Layer count：18
Board thickness：4mm
Dimension：30*25mm
Raw material：FR4 SY
Copper thickness on the board surface：140um
Copper thickness in the hole barrel：70um
Min.line width/space：0.3mm
Minimum hole diameter：1.25mm
Surface finishing：ENIG Au≥2u"
Application：Heavy duty power supply

Part Number：S02P27246
Layer count：2
Board thickness：1.1mm
Dimension：409*264mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：33um
Minimum hole diameter：0.6mm
Surface finishing：Immersion Tin
Application：Medical device

Part Number：S02B29437
Layer count：2
Board thickness：1.6mm
Dimension：210*132mm
Raw material：FR4 ITEQ
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.1mm
Minimum hole diameter：0.3mm
Surface finishing：Platinum plating + Gold plating
Application：Blood analyzer

Part Number：M04C07252A
Layer count：4
Board thickness：1.6mm
Dimension：159*110mm
Raw material：FR4 TUC
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au：1-3u"
Application：Display of medical device