Part Number：M04C20313
Layer count：4
Board thickness：0.8mm
Dimension：236*194mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.25mm
Minimum hole diameter：0.25mm
Surface finishing：ENIG Au≥1.2u"
Application：Wireless & RFID

▶Impedance control ±8%;
▶Min.solder mask dam: 0.08mm;
▶IPC class III compliant;