Part Number：M04N33909A
Layer count：4
Board thickness：0.5mm
Dimension：121*75mm
Raw material：FR4 Roger
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENEPIG Au≥2u"
Application：Telecommunication, 5G

▶Surface finish: ENEPIG
▶Min. via size: 0.2mm
▶Min.solder mask dam: 0.08mm
▶Material: Rogers RO4350B
▶Non-symmetrical lamination process, mechanism blind via