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Part Number：S01C25655
Layer count：1
Board thickness：2.2mm
Dimension：109*82mm
Raw material：Jinbao
Copper thickness on the board surface：70um
Copper thickness in the hole barrel：25um
Min.line width/space：0.2mm
Surface finishing：ENIG Au≥2u"
Application：Heavy duty power charging pile

Part Number：M02C22186
Layer count：2
Board thickness：1.5mm
Dimension：293*203mm
Raw material：FR4+PI+NFPP
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.3mm
Minimum hole diameter：0.4mm
Surface finishing：ENIG
Application：Intelligent home

Part Number：GHM06K08206A0
Layer count：6
Board thickness：0.6mm
Dimension：117*83mm
Raw material：FR4 TUC
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：22um
Min.line width/space：0.075mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG+OSP
Application：Wearable device

Part Number：M06C33742
Layer count：6
Board thickness：1.5mm
Dimension：311*133mm
Raw material：FR4 TUC
Copper thickness on the board surface：70um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.35mm
Surface finishing：ENIG Au：2-4u"
Application：Power supply