Part Number：M18C09478
Layer count：18
Board thickness：4mm
Dimension：30*25mm
Raw material：FR4 SY
Copper thickness on the board surface：140um
Copper thickness in the hole barrel：70um
Min.line width/space：0.3mm
Minimum hole diameter：1.25mm
Surface finishing：ENIG Au≥2u"
Application：Heavy duty power supply

▶HLC board, ENIG
▶Edge plated
▶Barrel copper thickness>70um
▶Resistance testing
▶Copper thickness: 3oz(inner layer)/4oz(outter layer)