How to solve impedance problems for high frequency PCB：
1. Regarding the control parameters of impedance, the control requirements can be achieved through mutual adjustment in production.
2. After lamination in the production, the board is sliced and analyzed. If the thickness of the medium is reduced, the line width can be reduced to meet the requirements; if the thickness is too thick, the copper can be thickened to reduce the impedance value.
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3. In the test, if there is a lot of difference between the theory and the reality, the biggest possibility is that there is a problem with the engineering design and the test strip design.