High frequency PCB V-Scoring is a process of cutting a ‘V’ shaped groove at the top and bottom of a printed circuit board leaving a thin layer between the Vees. Once this is done, the PCB Board can easily be separated at the V by applying minimal pressure. 

A single PCB board can be divided in to multiple sections by V-Scoring. This is must useful during the PCB assembly process, as all sections of the board can be treated as a single PCB Board. This way components can be placed on each section of the board in a single run. Once the components placement process is completed, the boards can then be separated at the Vees. This makes the assembly process more efficient saving both time and money.

A rule of thumb for the thickness of the high frequency PCB board remaining at the V is 1/3 of the board thickness. So if a board is 0.063 inches (1.57 mm) thick. the V-Score should have a depth of 0.021 inches (0.523 mm) on either side.