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Networking & Server
Part Number：S12S32134
Layer count：12
Board thickness：2.32mm
Dimension：266*216mm
Raw material：FR4 Isola
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.12mm
Minimum hole diameter：0.15mm
Surface finishing：immersion Silver
Application：Networking & Server
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Filter
Part Number：M02S21361A
Layer count：2
Board thickness：0.9mm
Dimension：136*157mm
Raw material：FR4 ITEQ
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.3mm
Minimum hole diameter：0.5mm
Surface finishing：immersion Silver
Application：Filter
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Telecommunication, 5G
Part Number：M04N33909A
Layer count：4
Board thickness：0.5mm
Dimension：121*75mm
Raw material：FR4 Roger
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENEPIG Au≥2u"
Application：Telecommunication, 5G
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Wi-Fi
Part Number：S08C35600
Layer count：8
Board thickness：0.8mm
Dimension：175*180mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENEPIG Au≥1.2u"
Application：Wi-Fi
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Photoelectric module
Part Number：S06C33470
Layer count：6
Board thickness：0.6mm
Dimension：119*79mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥2u"
Application：Photoelectric module
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Wireless & RFID
Part Number：M04C20313
Layer count：4
Board thickness：0.8mm
Dimension：236*194mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.25mm
Minimum hole diameter：0.25mm
Surface finishing：ENIG Au≥1.2u"
Application：Wireless & RFID