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Part Number:M02C22186
Layer count:2
Board thickness:1.5mm
Dimension:293*203mm
Raw material:FR4+PI+NFPP
Copper thickness on the board surface:35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.3mm
Minimum hole diameter:0.4mm
Surface finishing:ENIG
Application:Intelligent home
Part Number:S10C31828
Layer count:10
Board thickness:1.2mm
Dimension:183*138mm
Raw material:FR4 EMC
Copper thickness on the board surface:35um
Copper thickness in the hole barrel:22um
Min.line width/space:0.07mm
Minimum hole diameter:0.1mm
Surface finishing:ENIG Au≥1u"
Application:UAV
Part Number:GHM06K08206A0
Layer count:6
Board thickness:0.6mm
Dimension:117*83mm
Raw material:FR4 TUC
Copper thickness on the board surface:35um
Copper thickness in the hole barrel:22um
Min.line width/space:0.075mm
Minimum hole diameter:0.2mm
Surface finishing:ENIG+OSP
Application:Wearable device