As PCB factory china knows that, one of the most troubling aspects of moisture-related damage to products is that it can be difficult to detect during the PCB assembly and testing process. Any components that are sheathed in plastic or organic compounds are susceptible to this type of damage.

Moisture absorption damage typically occurs during the solder reflow process. A combination of rapid moisture expansion and mismatched materials contribute to the various types of damage induced by humidity. Ball grid array and chip-scale packages are particularly sensitive to moisture damage.

Surface-mount PCBs tend to absorb moisture more rapidly than through-hole PCBs. Surface-mount boards tend to be thinner, thus having lower fracture strength.