In order to integrate design and production, Flex rigid PCB factory’s engineers need to consider the following issues:
 
(1) the via cannot be located on the pad;
 
(2) the contact area between the metal shell of the device and the Flex rigid PCB extends outward and there can be no via in the 1.5mm area.

 
(3) there should be no via in the spot coating or printing area of the patch. Such as the use of patch glue dot coating or printing process of CHIP, SOP components under the Flex rigid PCB area.
 
(4) the inner diameter of the full pass hole requires 0.2mm (8mil) and above in principle, and the outer diameter is above 0.4mm (16mil). If there are difficulties, the outer diameter must be controlled as 0.35mm (14mil).
 
(5) it is suggested that buried blind holes should not be used in the design of BGA in 0.65mm and above, and the cost will be greatly increased.
 
(6) the distance between the via and the via should not be too close, drilling is easy to cause hole breakage, generally require hole spacing 0.5mm or above, 0.35mm-0.4mm to avoid, 0.3mm and below prohibited.