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Flexible PCB manufacturer:Immersion Silver Surface Finish Process

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Popularity:94Dated :07-21-2022 02:37【big well Small

As flexible PCB manufacturer knows that, the application of immersion tin on a FPC requires some steps. These steps include:

Pre-cleaning

This stage requires you to prepare your FPC. It is the first stage of the immersion process. Here, you will need to dip the FPC in a chemical solution to remove any contaminants on the surface. Also, you will dip the circuit board in an acidic solution to achieve this.

The pre-cleaning process helps to enhance the effectiveness of the plating process. Therefore, it is an important step. Furthermore, you need to use water to rinse the FPC surface. This will help to eliminate any debris and the remaining cleaning solution on the FPC surface.

Micro-etching

This requires you to dip the FPC in sulfuric acid. The purpose of micro-etching is to roughen the copper layer structure. Therefore, this helps to enhance the copper layer. Also, this will get the copper surface ready for the tin layer. The copper surface will bind with the tin layer effectively.

Furthermore, use water to clean the FPC surface. This will help to eliminate any residues.

As flexible PCB manufacturer knows that, the application of immersion tin on a FPC requires some steps. These steps include:

Pre-cleaning

This stage requires you to prepare your FPC. It is the first stage of the immersion process. Here, you will need to dip the FPC in a chemical solution to remove any contaminants on the surface. Also, you will dip the circuit board in an acidic solution to achieve this.

The pre-cleaning process helps to enhance the effectiveness of the plating process. Therefore, it is an important step. Furthermore, you need to use water to rinse the FPC surface. This will help to eliminate any debris and the remaining cleaning solution on the FPC surface.

Micro-etching

This requires you to dip the FPC in sulfuric acid. The purpose of micro-etching is to roughen the copper layer structure. Therefore, this helps to enhance the copper layer. Also, this will get the copper surface ready for the tin layer. The copper surface will bind with the tin layer effectively.

Furthermore, use water to clean the FPC surface. This will help to eliminate any residues.

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