Part Number：M02C15591A
Layer count：2
Board thickness：1.5mm
Dimension：222*199mm
Raw material：FR4 Isola
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：30um
Min.line width/space：0.2mm
Minimum hole diameter：0.5mm
Surface finishing：ENIG Au≥2u"
Application：Engine governor

Part Number：M04N33909A
Layer count：4
Board thickness：0.5mm
Dimension：121*75mm
Raw material：FR4 Roger
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENEPIG Au≥2u"
Application：Telecommunication, 5G

Part Number：S08C35600
Layer count：8
Board thickness：0.8mm
Dimension：175*180mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENEPIG Au≥1.2u"
Application：Wi-Fi

Part Number：S06C33470
Layer count：6
Board thickness：0.6mm
Dimension：119*79mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥2u"
Application：Photoelectric module 

Part Number：M04C20313
Layer count：4
Board thickness：0.8mm
Dimension：236*194mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.25mm
Minimum hole diameter：0.25mm
Surface finishing：ENIG Au≥1.2u"
Application：Wireless & RFID

Part Number：M08C33097A
Layer count：8
Board thickness：1.0mm
Dimension：156*100mm
Raw material：FR4 TUC
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：22um
Min.line width/space：0.09mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG
Application：Intelligent home

Part Number：M02P31818A
Layer count：2
Board thickness：0.8mm
Dimension：27*12mm
Raw material：FR4 Nelco
Copper thickness on the board surface：36um
Copper thickness in the hole barrel：20um
Min.line width/space：1.4mm
Minimum hole diameter：0.6mm
Surface finishing：Immersion Tin
Application：Automotive antenna

Part Number：M06C34768A
Layer count：6
Board thickness：1.6mm
Dimension：112*112mm
Raw material：FR4 ITEQ
Copper thickness on the board surface：30-50um
Copper thickness in the hole barrel：20um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au≥1u"
Application：Driving recording

Part Number：S02C30060
Layer count：2
Board thickness：1.5mm
Dimension：155*193mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：30um
Min.line width/space：0.1mm
Minimum hole diameter：0.3mm
Surface finishing：ENIG Au≥2u"
Application：Integrated sensor