Technical Parameters
Part Number：M04N33909A
Layer count：4
Board thickness：0.5mm
Dimension：121*75mm
Raw material：FR4 Roger
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENEPIG Au≥2u"
Application：Telecommunication, 5G
Technology Feature
?Surface finish: ENEPIG
?Min. via size: 0.2mm
?Min.solder mask dam: 0.08mm
?Material: Rogers RO4350B
?Non-symmetrical lamination process, mechanism blind via
*Your info requiredLeave
your contact info to ask for more product details
| * Contact name： | |
| Company name： | |
| * Phone number： | |
| Email： | |
| * Your message： | |
| Verification code： |
|
S&L product center
