Technical Parameters
Part Number：S08C35600
Layer count：8
Board thickness：0.8mm
Dimension：175*180mm
Raw material：FR4 SY
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENEPIG Au≥1.2u"
Application：Wi-Fi
Technology Feature
?Min.via size: 0.2mm;
?Solder mask plugging
?Impedance control ±8%;
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