S& L

Leading the innovation of PCB technology with 87 patents With team of 400 engineers, we provide total PCB solution from design optimization consultant to cost-effective manufacturing

Technical Parameters

Part Number:M04C20313
Layer count:4
Board thickness:0.8mm
Raw material:FR4 SY
Copper thickness on the board surface:35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.25mm
Minimum hole diameter:0.25mm
Surface finishing:ENIG Au≥1.2u"
Application:Wireless & RFID

Technology Feature

?Impedance control ±8%;
?Min.solder mask dam: 0.08mm;
?IPC class III compliant;

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