Technical Parameters
Part Number：GHM10C02478A0
Layer count：10
Board thickness：1.6mm
Dimension：165*113mm
Raw material：FR4 EMC
Copper thickness on the board surface：35um
Copper thickness in the hole barrel：25um
Min.line width/space：0.1mm
Minimum hole diameter：0.2mm
Surface finishing：ENIG Au：2-4u"
Application：Access control
Technology Feature
?Profiling tolerance: ±0.1mm, IPC class III complaint, Min. BGA pad: 0.2mm
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